Employing proprietary optical scanning technology, the CP7300 provides fast, noncontact, automated 3D surface height, roughness, and local area planarity and uniformity measurements on wafers for rapid, quantitative characterization of photo-lithographic, etch, and polishing process effects. Surface metrology applications include, but are not limited to, measurement and process control of critical surface texture parameters on bare and patterned wafers.

Programmable and automated measurement sequences and sample positioning allows for surface characterization at multiple sites and locations. Integral to each system is a comprehensive and powerful software analysis package with application-specific modules, providing full 3D imaging and data reporting of many surface topography parameters.

• Fast accurate, repeatable 3D areal surface mapping – in just seconds!
• Noncontact measurements – under ambient conditions!
• Patented, proprietary vertical scanning technology provides superior vertical resolution (~0.1 nm) – in a single measurement!
• Large, dynamic vertical (Z) scan range
• from 0.1 nm to 20 mm!
• 0.5X – 200X magnification range – to meet all your lateral resolution and field size needs!
• Automated sample measurement and positioning capabilities – for increased ease-of-use!
• Standard and custom solutions and configurations available – to meet your application requirements.