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CP6300 Wafer Metrology System

Employing proprietary optical scanning technology, the CP6300 provides fast, noncontact, automated 3D surface height, roughness, and local area planarity and uniformity measurements on wafers for rapid, quantitative characterization of photo-lithographic, etch, and polishing process effects. Surface metrology applications include, but are not limited to, measurement and process control of critical surface texture parameters on bare and patterned wafers.

  • Fast accurate, repeatable 3D areal surface mapping – in just seconds!
  • Measure wafer bow and warp for 8” and 12” wafers
  • Noncontact measurements – under ambient conditions!
  • Patented, proprietary vertical scanning technology provides superior vertical resolution (~0.1 nm) – in a single measurement!
  • Large, dynamic vertical (Z) scan range
  • from 0.1 nm to 15 mm!
  • 0.5X – 200X magnification range – to meet all your lateral resolution and field size needs!
  • Automated sample measurement and positioning capabilities – for increased ease-of-use!
  • Standard and custom solutions and configurations available – to meet your application requirements e.g. for clean room environments

Please contact us for more information on the Zygo CP6300 Wafer Metrology System

Click here to download the CP6300 Data Sheet