Optical Critical Dimension Measuring Systems
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Many modern manufacturing operations require dimensional or positioning accuracies in the sub-micron region. Noncontact measuring techniques are often required because the components being measured are in general very small and delicate. View Micro-Metrology offers two solutions for these high-accuracy measurements: field of view (FOV) and point-to-point (PTP) systems. The MicroLine systems give FOV measurements and the Precis 200 system combines both FOV and PTP measurements. |
Microline
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The MicroLine® series of non-contact critical dimensional measurement systems are ideal for semiconductor and MEMS applications.
MicroLine critical dimension measurement systems are designed specifically for semiconductor and MEMs wafer and photomask CD metrology. MicroLine systems automatically measure linewidth, overlay registration, and other critical features. MicroLine Systems are equipped with the highest quality microscope optics and precision motion stages, providing capability to measure features from 0.5 µm to 400 µm in size. Typical measurement accuracy and repeatability is 10 nm at 1 δ (with 100x objective). The MicroLine is offered in four configurations: MicroLine 300:
MicroLine 400:
MicroLine 420:
MicroLine 520:
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Precis
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The all-new Precis® incorporates the most advanced design and technology from VIEW-MM. Based on the proven Innova wafer metrology system from Micro-Metric, the new Precis includes a number of configurable options that make the system more versatile, serviceable and reliable:
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