Characterisation, Measurement & Analysis
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Ion Beam Preparation

Ion Beam Preparation

The high precision 1040 Nano Mills for the reduction of amorphous implanted layers on your Lamella, post-FIB (focused ion beam) processing or the enhancement of conventionally prepared specimens. Ion energies as low as 50 eV and a beam size as small as 1 µm. It allows specimens to ...
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  1. Fischione Model 1040 NanoMill® TEM specimen preparation system

    Fischione Model 1040 NanoMill® TEM specimen preparation system

    • Ultra-low energy ion source
    • Concentrated ion beam
    • Removes amorphous and implanted layers
    • Ideal for post-focused ion beam processing and milling of conventionally prepared specimens
    • Liquid nitrogen-cooled specimen stage
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  2. Fischione Model 1051 TEM Mill

    Fischione Model 1051 TEM Mill

    • High energy operation for rapid milling; low energy operation for specimen polishing
    • Two independently adjustable TrueFocus ion sources
    • Ion source maintains its small beam diameter over a wide range of operating energies (100 eV to 10 keV)
    • Continuously adjustable milling angle range of -15 to +10°
    • Adjustable 10-inch touch screen with a user-friendly interface for simple setup of milling parameters
    • Specimen holder with x-y adjustment
    • In situ viewing and image capture during milling
    • Liquid nitrogen-cooled specimen stage
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  3. Fischione Model 1061 SEM Mill

    Fischione Model 1061 SEM Mill

      • Minimal maintenance - 

        Due to the efficiency of ionization, maintenance of the TrueFocus ion source is minimal and the components have an extremely long life. Material sputtered from the ion source is negligible, minimizing both sample contamination and component maintenance. Automated shuttering prevents the buildup of sputtered material on the viewing window. All system components are easily accessible for routine cleaning.
      • Programmable - Sample rotation is 360° with variable rotation speed and a sample rocking feature. The instrument automatically senses the sample thickness and establishes the milling plane, which maximizes throughput. A magnetic encoder provides absolute positioning accuracy.
      • Automatic termination - The ion milling process can be automatically terminated by elapsed time or by temperature. 
          • Time - A timer allows milling to continue for a predetermined time and then turns off the energy to the ion sources when the time has elapsed. The sample remains under vacuum until the load lock is vented. 
          • Temperature - The thermal safeguard associated with the sample cooling system will stop the process if the sample stage reaches a preset temperature. 
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    • Fischione Model 1063 WaferMill™ ion beam delayering solution

      Fischione Model 1063 WaferMill™ ion beam delayering solution

      • Selected-area milling on full 300 mm wafers
      • Top-down delayering
      • Expose multiple device layers and structures
      • For use in multiple areas of a semiconductor fabrication facility:
        – Research and development
        – Process control
        – Yield enhancement
        – Failure analysis
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    • Fischione Model 1080 PicoMill® TEM specimen preparation system

      Fischione Model 1080 PicoMill® TEM specimen preparation system

      • Achieve ultimate specimen quality – free from amorphous and implanted layers
      • Complements FIB technology
      • Milling without introduction of artifacts
      • Advanced detector technology for imaging and precise endpoint detection
      • In situ imaging with ions and electrons
      • Microscope connectivity for risk-free specimen handling
      • Adds capability and capacity
      • Fast, reliable and easy to use
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