Characterisation, Measurement & Analysis
+44(0)1582 764334
Ion Beam Preparation

Ion Beam Preparation

The high precision 1040 Nano Mills for the reduction of amorphous implanted layers on your Lamella, post-FIB (focused ion beam) processing or the enhancement of conventionally prepared specimens. Ion energies as low as 50 eV and a beam size as small as 1 µm. It allows specimens to ...
› Read More

List  Grid 

Set Descending Direction
per page
  1. Fischione Model 1040 NanoMill® TEM specimen preparation system

    Fischione Model 1040 NanoMill® TEM specimen preparation system

    • Ultra-low energy ion source
    • Concentrated ion beam
    • Removes amorphous and implanted layers
    • Ideal for post-focused ion beam processing and milling of conventionally prepared specimens
    • Liquid nitrogen-cooled specimen stage
    Learn More

    View

  2. Fischione Model 1051 TEM Mill

    Fischione Model 1051 TEM Mill

    • High energy operation for rapid milling; low energy operation for specimen polishing
    • Two independently adjustable TrueFocus ion sources
    • Ion source maintains its small beam diameter over a wide range of operating energies (100 eV to 10 keV)
    • Continuously adjustable milling angle range of -15 to +10°
    • Adjustable 10-inch touch screen with a user-friendly interface for simple setup of milling parameters
    • Specimen holder with x-y adjustment
    • In situ viewing and image capture during milling
    • Liquid nitrogen-cooled specimen stage
    Learn More

    View

  3. Fischione Model 1061 SEM Mill

    Fischione Model 1061 SEM Mill

    • High energy operation for rapid milling; low energy operation for sample polishing
    • Two independently adjustable TrueFocus ion sources
    • Ion source maintains its small beam diameter over a wide range of operating energies (100 eV to 10 keV)
    • Adjustable 10-inch touch screen with a user-friendly interface for simple setup of milling parameters
    • Create pristine cross-section samples with the Cross-section station (optional)
    • Adjustable milling angle range of 0 to +10°
    • In situ viewing and image capture during milling
    • Automatic termination by time or temperature
    • Liquid nitrogen-cooled sample stage (optional)
    Learn More

    View

  4. Fischione Model 1063 WaferMill™ ion beam delayering solution

    Fischione Model 1063 WaferMill™ ion beam delayering solution

    • Selected-area milling on full 300 mm wafers
    • Top-down delayering
    • Expose multiple device layers and structures
    • For use in multiple areas of a semiconductor fabrication facility:
      – Research and development
      – Process control
      – Yield enhancement
      – Failure analysis
    Learn More

    View

  5. Fischione Model 1080 PicoMill® TEM specimen preparation system

    Fischione Model 1080 PicoMill® TEM specimen preparation system

    • Achieve ultimate specimen quality – free from amorphous and implanted layers
    • Complements FIB technology
    • Milling without introduction of artifacts
    • Advanced detector technology for imaging and precise endpoint detection
    • In situ imaging with ions and electrons
    • Microscope connectivity for risk-free specimen handling
    • Adds capability and capacity
    • Fast, reliable and easy to use
    Learn More

    View

List  Grid 

Set Descending Direction
per page