The LUXOR^Au is an advanced, fully automated sputtering device that applies a fine grain gold coating from 1 to 100 nm thickness. This allows you to get the very best SEM imaging quality from your samples.

LUXOR’s unique A² technology generates a gold plasma and sprays it in a controlled and accurate manner, resulting in an extremely uniform, thin and homogeneous gold layer.

The LUXOR^Au is also renowned for its ease of use and quick, hassle-free operation.

Gold target Ø 30 mm, thickness 100 µm (99.999% purity) for use with both LUXOR^Au and LUXOR^Pt

The LUXOR^Pt is a highly innovative, fully automated sputtering device which applies a fine grain platinum or gold coating from 1 to 100 nm thickness.

LUXOR’s unique A² technology assures that the gold or platinum is sprayed in a highly controlled and precise manner, resulting in an extremely uniform, thin and homogeneous coating.

This allows your scanning electron microscope to show the best possible image quality.

Platinum target Ø 30 mm, thickness 100 µm (99,999% purity) for use with LUXOR^Pt

The LUXOR sample holder for mounted/embedded samples can hold all types of samples that are mounted or embedded into resins with diameter ranging from 25 mm to 40 mm and height from 10 mm to 50 mm.

Two-stage roughing-pump with a pump capacity of 4.8 m³/h (80L/min)

The Quorum Q150R Plus is suitable for use with Tungsten/LaB6 SEM and Benchtop SEM.

Typical uses: 

• Sputter coating of noble metals using the Q150R S & ES Plus:
• Recommended for magnifications:
• up to x 50k using Au, Au/Pd
• up to x 100k using Pt (optional)
• Carbon cord coating for elemental analysis using the Q150R E & ES Plus.

The Quorum Q150T Plus is optimised for use with a turbomolecular pump, which gives a lower vacuum down to 5 x 10-5 mbar. 

The Q150T Plus is available in three formats: 

Suitable for multi-layer sequential sputtering of two materials, the Quorum Q300T D Plus has two independent sputtering heads, which allows sequential sputtering of two metals without the need to break vacuum. The system is fully automated with user defined recipes controlling the pumping sequence, time, number of sputter cycles, and the current used during the process. Unlimited layers of varying thickness from two target materials can be sputtered sequentially by cycling between both targets.  When not in use the targets are shuttered for protection from contamination.