Home Ion Beam Preparation Fischione Model 1080 PicoMill® TEM Specimen Preparation System

Fischione Model 1080 PicoMill® TEM Specimen Preparation System

Product Code:
Manufacturer: Fischione
  • Achieve ultimate specimen quality – free from amorphous and implanted layers
  • Complements FIB technology
  • Milling without introduction of artifacts
  • Advanced detector technology for imaging and precise endpoint detection
  • In situ imaging with ions and electrons
  • Microscope connectivity for risk-free specimen handling
  • Adds capability and capacity
  • Fast, reliable and easy to use

More info and finance questions

Request a Quote

Please type the letters and numbers below

Post-FIB processing produces the highest quality TEM specimens
Focused ion beam (FIB) milling is a widely used technique for today’s cutting-edge materials that provides a means to prepare transmission electron microscopy (TEM) specimens. The challenge in working with these advanced materials is to create specimens that are electron transparent and are free from artifacts. The FIB is highly effective in preparing TEM specimens, but the use of a high-energy, liquid metal ion source can often result in specimen amorphization, gallium implantation, or both.

The Fischione Model 1080 PicoMill system is the ideal complement to FIB technology; it adds the increased capability of producing optimal specimen quality while enhancing the overall specimen preparation throughput by moving final thinning offline.

Let the FIB do what the FIB does best; let the PicoMill system do the rest
To maximise FIB capacity, specimens can be moved offline for final thinning on the Fischione Model 1080 PicoMill system. The PicoMill system provides the ability to precisely and predictably thin a specimen, which reduces the potential for rework and optimizes specimen processing time. This increases your capability by producing specimens of superior quality and enhances the overall specimen preparation throughput. 

The PicoMill system will allow you to achieve first time right specimen preparation every time.

Site-specific, ultra-low-energy milling
The PicoMill system’s ion source features a filament-based ionization chamber and electrostatic lenses. The ion source was specifically developed to produce ultra-low ion energies with a submicron ion beam diameter. It uses inert gas (argon) and has an operating voltage range of 50 eV to 2 kV. 

The ion source’s feedback control algorithm automatically produces stable and repeatable ion beam conditions over a wide variety of milling parameters. Redeposition of sputtered material onto the area of interest is avoided because the ion beam can be focused to a specific area. You can scan a region of the specimen’s surface or target a specific area for selective milling. The ions only contact the site of interest on the specimen where they are needed to do the work. The ion beam is kept away from the grid, which prevents redeposition.

Precise milling angle adjustment
The ion beam impingement angle is programmable from -15° to +90°. The ion source is fixed in position and the goniometer tilts the specimen holder to achieve the programmed milling angle through the PicoMill system user interface. The specimen is positioned along the X, Y, and Z axes to precisely orient the FIB lamella with respect to the ion and electron beams.

Milling specimens at a low angle of incidence (fewer than 10°) minimizes damage and specimen heating. Because low-angle milling, combined with ion beam rasterizing, facilitates uniform thinning of dissimilar materials, it is highly beneficial when preparing layered structures or composite materials. 

In situ imaging
To complement the scanning electron column, the PicoMill system has multiple detectors: 

  • A backscatter electron detector (BSE) for in situ imaging with electrons

  • secondary electron detector (SED) for in situ imaging with ions and electrons 

  • A scanning/transmission electron detector (STEM) for electron transparency and endpoint detection

The detector combination allows you to perform in situ imaging of the specimen before, during, and after ion milling. The grid containing a FIB lamella or a specific site on a conventionally prepared specimen can be imaged.

You can view specimens in situ on a dedicated monitor that displays both electron- and ion-induced secondary electron images. Image capture is as simple as a click of a mouse. 

End-point detection/process termination
A specimen prepared with optimal electron transparency is the ultimate goal for the best quality TEM imaging and analysis. This is particularly key when employing today’s aberration-corrected TEM technology.

As the specimen thins, electron transmission increases and the leading edge recedes, which allows the STEM detector to provide end point information. The PicoMill system is also capable of time-based termination or it can be stopped manually.

Microscope connectivity reduces specimen handling
The ability to use the same holder in the PicoMill system and the TEM means that you can quickly and safely transport the milled specimen from the PicoMill system to the TEM, which is particularly advantageous when you are working with one-of-a-kind specimens.

MODEL 1080 PicoMill® TEM specimen preparation system


Primary: Microelectronics and semiconductor transmission electron


microcopy (TEM) specimen preparation


Secondary: Any other specimens requiring optimal results


Ideal for when FIB preparation is combined with aberration corrected TEM

Ion source

Filament-based ion source combined with electrostatic lens system


Variable voltage (50 eV to 2 kV), continuously adjustable


Beam current density up to 8 mA/cm2


Beam size < 1 μm

Electron source

Accelerating voltage up to 15 keV


Working distance of 16 mm


Faraday cup for electron beam current monitoring with a range of


1 to 2,000 pA


TEM style


X, Y, and Z axes movement and  _ tilt


Specimen exchange of < 30 seconds


Milling angle range of −15 to +90°


Viewing range -15 to 180°


Side-entry, TEM-style holder


Single-tilt with ±20° in-plane rotation

Ion beam

Ion beam can be targeted to a specific point on the specimen surface or


scanned within a selected area

User interface

Menu-driven with system status displayed


Ion source gas: UHP 99.999% argon


Gas control: Automated using mass flow control technology


Pneumatic supply: Compressed dry air or dry nitrogen at 2 to 7 bar


Secondary electron detector/Everhart-Thornley detector


• Electron imaging with 2 mm field of view


• Ion-induced secondary electron imaging with 1.9 mm field of view


• Specimen image displayed on PicoMill system user interface


Solid-state backscatter electron detector


Solid-state scanning/transmission electron (STEM) detector

Vacuum system

Turbomolecular drag pump backed by an oil-free diaphragm pump


Specimen chamber pressure:


• Base vacuum of 3 x 10-6 mbar


• Operating vacuum of 1 x 10-4 mbar


Electron column: Base vacuum of 1 x 10-6 mbar


Specimen goniometer: Atmosphere to 1 mbar (pre-pump)


Vacuum gauges:


• Cold cathode for specimen chamber and electron column


• Pirani gauge for goniometer

Automatic termination

Termination by time, electron signal, or manual process


80.75 in. [205.51 cm] width x 57.85 in. [146.94 cm] height x 50.13 in. [127.33 cm] depth


500 lbs. [227 kg]


208-240 VAC, 50/60 Hz, 1,100 W


One year

Service contract

Download service contract information

*Standard side-entry TEM specimen holders cannot be used in the PicoMill system because they do not provide access to the specimen for ion milling. However, the PicoMill system holder can be used in both the PicoMill system and in corresponding electron microscopes.

Write Your Own Review
You're reviewing:Fischione Model 1080 PicoMill® TEM Specimen Preparation System
Your Rating
Photo Product SKU
Fischione Model 1062 TrionMill Fischione Model 1062 TrionMill - >
Fischione Model 1064 ChipMill Fischione Model 1064 ChipMill - >
Fischione Model 1040 NanoMill® TEM specimen preparation system Fischione Model 1040 NanoMill® TEM specimen preparation system - >
Fischione Model 1051 TEM Mill (Ion Milling) Fischione Model 1051 TEM Mill (Ion Milling) - >
Fischione Model 1061 SEM Mill (Ion Milling) Fischione Model 1061 SEM Mill (Ion Milling) - >
Fischione Model 1063 WaferMill™ ion beam delayering solution Fischione Model 1063 WaferMill™ ion beam delayering solution - >