Ar ion milling of specimens on carbon support grids

The PicoMill system's scanning transmission electron microscope (STEM) detector images of EXLO specimens from a 20 nm NAND solid-state drive device. Before (first row, left) and after (first row, right) concentrated Ar ion beam milling images show an intact specimen while parts of the perforated carbon support were milled off. Bright-field TEM imaging before (second row, left) and after (second row, right) Ar ion milling reveals a reduction of curtaining (blue arrows) and removal of sputtered material (yellow arrows).

The method of initially preparing specimens in the focused ion beam (FIB) and subsequently extracting the specimen outside the FIB and placing them on carbon support grids is called the ex situ lift-out (EXLO) technique. This technique increases throughput, which makes it a prevalent technique in the semiconductor industry. 

The carbon support on the EXLO specimen is problematic if the specimen needs to be further thinned once it is on the grid. To maintain the specimen’s integrity and to obtain high-quality specimens free from FIB damage, controlled specimen thinning of EXLO specimens on carbon support grids is achieved by post-FIB concentrated Ar ion beam milling using Fischione Instruments’ Model 1080 PicoMill® TEM specimen preparation system. The PicoMill system’s integrated electron column and detectors allow for in situ imaging while ion milling to track both specimen and carbon support.

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