Overview of Pulsed Light Measurement Why use pulsed light? A semiconductor laser emits light by a driving current. This drive current causes the semiconductor laser chip to generate heat, causing a shift in the output wavelength and potentially damaging the laser. To avoid such problems, pulse-driven light emission is widely used. Furthermore, high-power industrial lasers may require an energy accumulation...
Lambda News
Lambda is a leading supplier of characterisation, measurement and analysis equipment, applied to signals from DC to Light. Our company provides hardware, software and integrated solutions throughout the UK & Ireland.
-
OSA: SMSR Measurement of High-Power O-band Lasers for Optical Transceivers
Optical transceivers are one of the indispensable key devices for optical communications that interconvert optical and electrical signals. There are various types of optical transceivers: SFP, QSFP, 200GbE, 400GbE, and other network standards. In recent years, optical transceivers have become increasingly high-power to extend communication distance. To accomplish this, the laser in an optical transceiver must have a longer cavity length to achieve high power capability, which causes side mode wavelengths close to the main signal. This increases the need for high resolution/high dynamic range in SMSR (Side Mode Suppression Ratio) measurements. The AQ6380, which offers high resolution and wide dynamic range, is the perfect solution for SMSR measurements of O-band lasers for 400GbE QSFP-DD optical transceivers. Reasons why engineers choose the AQ6380 monochromator OSA: 5 pm... -
Zygo Unveils Industry’s Widest FOV Interferometric Objective — The 0.5X ZWF
Zygo, a global leader in precision metrology and optical solutions, has announced the launch and availability of its groundbreaking 0.5X ZWF (Zygo Wide Field) Objective— the widest field-of-view (FOV) interferometric objective commercially available. Engineered for high-speed, high-precision measurement applications, the 0.5X ZWF Objective is set to redefine efficiency and accuracy in industries such as semiconductor, precision machining, and photonics. Invented... -
WEBINAR: Large-area SEM sample preparation for industrial applications
Tuesday, July 15, 18.00 BST Backscatter electron image (top) of a 7 mm Ti-6Al-4V cross-section sample; electron backscatter diffraction (EBSD) map (bottom) collected over the same surface showing full-area crystallographic orientation inverse pole figure map. Modern materials analysis demands sample preparation tools that can keep up with the size, complexity, and sensitivity of engineering materials used in aerospace, semiconductors, and lithium-ion... -
Oscilloscope Technical FAQ: Oscilloscopes Key Features
Oscilloscopes are essential tools for engineers, technicians, and researchers working with electronic signals. Choosing the right oscilloscope and understanding its technical specifications can significantly impact measurement accuracy and efficiency. This FAQ addresses some of the most important aspects of oscilloscope performance and application. General QuestionsWhat is an oscilloscope?An oscilloscope is an electronic test instrument used for observing the precise shape... -
STT-MRAM device - Preparing specimens for imaging and analysis
Plan view TEM specimens from a fully fabricated spin-transfer torque magnetic random-access memory (STT-MRAM) device were prepared using a Ga FIB system. Post-FIB concentrated Ar ion beam milling using the Model 1080 PicoMill® TEM specimen preparation system of these plan view TEM specimens allowed controlled thinning and produced artifact-free TEM specimens. FIB plan view specimen preparation followed by concentrated Ar... -
WEBINAR: An easier, faster, and more accurate Ar ion milling technique for TEM specimen preparation
Join us for a webinar where we introduce an advanced Ar ion milling technique designed to make your work easier, faster, and more accurate. Click here to view a recording of the event. Traditional Ga focused ion beam (FIB) and Xe plasma FIB milling often cause amorphization and leave ion-implanted layers on TEM specimens. Fischione Instruments’ NanoMill® TEM specimen preparation system has... -
Shock Deformation Studies
Shear band and dynamic recovery of hexagonal close-packed materials.Mg corrodes very quickly when in contact with water, therefore it requires special precautions during mechanical and electrolytic polishing. Mg is also a very soft, which makes it difficult to obtain a deformation-free surface using standard sample preparation techniques. An alternative technique is to use broad ion beam milling, such as Fischione Instruments’ Model... -
Preparing thin films on silicon nitride-type TEM grids for atomic resolution imaging
Achieving atomic-resolution microscopy of Al-Cu thin films on electron-transparent silicon nitride TEM grids is hindered by the limitations of conventional preparation techniques. Dimpling, grinding, and standard ion milling are incompatible with the grid's fragile and stressed silicon nitride window. Additionally, the focused ion beam (FIB) lift-out technique risks rupturing the stressed windows, which can cause specimen loss. Ga contamination during FIB... -
LAS™ Lens Alignment Technology - The Basics
The Optical Alignment Lens Alignment Station (LAS™) employs a focused laser beam in reflection to measure the surface decenter and tilt. Following reflection from the lens surface, the laser beam is focused to a bright spot on the LAS™ camera at two distinct vertical locations - Normal (or Cat’s Eye) and Confocal. The Normal signal occurs when the focused laser reflects directly from the...