Thursday, 18th March 2021, 15.00

You are invited to join us for a webinar where we review the sample preparation steps needed to perform analysis on a solder pump. Specifically using the Fischione Model 1061/2 SEM Ion Mill. 

You will receive a link to a recording of the webinar after the event if you are not able to attend the live session.

REGISTER: Click here

Microelectronic device packaging includes solder joints that connect the package and board. Failure of these joints can cause a loss of connectivity between copper pads and solder bumps. Accurate failure analysis of solder junctions is critical for microelectronic device reliability.

In this webinar, you will learn best practices for cross-section sample preparation of large areas that contain multiple solder bumps, as well as targeting of individual solder junctions. Different sample techniques will be described and compared, including solder bump sample preparation using Fischione Instruments’ broad ion beam mills, Model 1061 SEM Mill and Model 1062 TrionMill.

For more information regarding Fischione products available from Lambda Photometrics please click here.